Thermal Interface Material (TIM)

The paste, pad or phase-change material that fills the microscopic air gaps between a power component and the heat sink. The thermal conductivity of air is about 0.026 W/mK while typical thermal paste is in the 1–8 W/mK band; this difference lowers the contact thermal resistance several times over and visibly reduces the junction temperature.

No matter how finely two metal surfaces are machined, the real contact area is a small fraction of the total area; the rest is air gap, and air is an excellent insulator. The interface material fills those gaps.

The cost of a dry mounting is greater than supposed; at the same loss the junction temperature can rise by tens of degrees. When refitting a component removed during maintenance or replacement, clean off the old paste and apply new.

Knowledge Center