Potting
It is the sealing of an electronic board by filling it with an epoxy, polyurethane or silicone based resin. It provides protection against moisture, dust, vibration and chemical effects, and makes it easier to reach high IP ratings. Because resin conducts heat far better than air it improves cooling in some cases, but it makes repair effectively impossible.
Potting is a common production method that increases the durability of modules working in field conditions. The ability of an IP67 class module such as the PT500 to withstand outdoor conditions is provided by the housing sealing and the internal protection measures working together.
- Moisture and condensation: When the board surface is covered with resin, no water film can form over the conductive tracks; leakage current and corrosion risk fall.
- Vibration: The legs of heavy components can fatigue and break under vibration. The resin supports these components mechanically; it makes a clear difference in vehicle and agricultural machinery applications.
- Heat: The thermal conductivity of the resin is higher than that of air, so heat is carried to the housing more easily. However, the resin also cuts off the airflow completely; cooling now only happens through the housing surface.
Component replacement is not possible in a potted module; in case of a fault the whole module is replaced. This is a choice that simplifies field maintenance but requires spares planning.
Context where this term is used: DC Motor Driver Selection Guide